Multilayer packaging materials suitable for electrostatic applications

Patent name Suitable for electrostatic applications Multi-layer packaging materials Patent applicant Eastman Chemical Corporation Principal applicant Address Tennessee inventor W.C. Jackson; D.S. McWilliams application (patent) No. 02806720.7 Date of application 2002.03 .07 Approval Date Approval Notice No. 1535205 Auditing Notice Day 2004.10.06 Manual CD-ROM D0440 Main Classification Number B32B27/08 Classification Number B32B27/08; B65D65/40 Sub-item Original Application No. Priority Document Abstract A multi-layer structure containing At least one destaticized outer layer and one conductive core layer. The outer layer comprises a material selected from the group consisting of an intrinsically destaticized polymer, a blend of an intrinsically destaticized polymer and a non-conductive matrix polymer, an intrinsically conductive material. A blend of the polymer and a non-conductive matrix polymer, the former being used in an amount sufficient to provide a surface resistivity greater than 10#+[5] but less than 10#+[12]Ω/sq., and mixtures thereof. The core layer comprises a material selected from the group consisting of an intrinsically conductive polymer, a blend of an intrinsically conductive polymer and a non-conductive matrix polymer, a conductive filler and a Blends of non-conductive matrix polymers and mixtures thereof. This multilayer structure surprisingly exceeds the prior art structure by the electrical properties because the surface resistivity of the outer layer in the multilayer structure is lower than when the outer layer is present alone or in another multilayer structure that is not in contact with the core layer Surface resistivity. Slaves 1. A multi-layered structure comprising at least one outer layer of an antistatic and one conductive core, wherein (a) the outer layer comprises a material selected from the group consisting of: (i) an intrinsic property Electrostatic polymer, (ii) a blend of an intrinsically destaticized polymer and a non-conductive matrix polymer, (iii) a blend of an intrinsically conductive polymer and a non-conductive matrix polymer The former is used in an amount sufficient to provide a surface resistivity greater than 105 and less than 1012 Ω/sq., and (iv) a mixture thereof; (b) the core layer comprises a material selected from the group consisting of: (i) a a conductive polymer, (ii) a blend of an intrinsically conductive polymer and a non-conductive matrix polymer, (iii) a blend of a conductive filler and a non-conductive matrix polymer, and Iv) A mixture thereof; wherein the surface resistivity of the outer layer of the multilayer structure is lower than the surface resistivity when the outer layer is not in contact with the core layer.